Metal contamination reduction in substrate processing systems with transformer coupled plasma
US12322579B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Jun 30, 2021 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Oct 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing system includes a processing chamber including a substrate support to support a substrate. A coil includes at least one terminal. An RF source configured to supply RF power to the coil. A dielectric window is arranged on one surface of the processing chamber adjacent to the coil. A contamination reducer includes a first plate that is arranged between the at least one terminal of the coil and the dielectric window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.