Dynamic process control in semiconductor manufacturing
US12322619B2 · kind B2 · utility
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Key dates
| Filing date | Aug 11, 2020 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Dec 19, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/32368
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and system are provided for dynamic process control in substrate processing, for example in semiconductor manufacturing applications. Some example systems and methods are provided for advanced monitoring and machine learning in atomic layer deposition (ALD) processes. Some examples also relate to dynamic process control and monitoring for chamber parameter matching and gas line charge times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.