Integrated adaptive positioning systems and routines for automated wafer-handling robot teach and health check
US12341040B2 · kind B2 · utility
0Cited by
39References
19Claims
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Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Sep 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and techniques for determining and using multiple types of offsets for providing wafers to a wafer support of a wafer station of a semiconductor processing tool are disclosed; such techniques and systems may use an autocalibration wafer that may include a plurality of sensors, including a plurality of edge-located imaging sensors that may be used to image fiducials associated with two different structures located in a selected wafer station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.