Electronic device cooling structures bonded to semiconductor elements
US12341083B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Dec 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid communication with the inlet and outlet, forming a plurality of nozzles on the first side of a second substrate, and forming a plurality of channels on the second side of the second substrate opposite the first side of the second substrate. The plurality of channels is aligned with the plurality of nozzles, and the second side of the first substrate is bonded to the first side of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.