Die last and waveguide last architecture for silicon photonic packaging

US12345932B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Bai Nie · Chandler, US
• Pooya Tadayon · Portland, US
• Leonel Arana · Phoenix, US
• Yonggang Li · Chandler, US
• Changhua Liu · Chandler, US
• Kristof Darmawikarta · Chandler, US
• Srinivas V. Pietambaram · Gilbert, US
• Tarek A. Ibrahim · Mesa, US
• Hari Mahalingam · San Jose, US
• Benjamin Duong · Chandler, US

Key dates

• Filing date: Sep 23, 2021
• Grant date: Jul 1, 2025
• Expiry date: Oct 30, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12038
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.