Capacitors in through glass vias

US12349282B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Benjamin Duong · Chandler, US
• Aleksandar Aleksov · Chandler, US
• Helme A. CASTRO DE LA TORRE · Gilbert, US
• Kristof Darmawikarta · Chandler, US
• Darko Grujicic · Chandler, US
• Sashi S. Kandanur · Chandler, US
• Suddhasattwa Nad · Chandler, US
• Srinivas V. Pietambaram · Gilbert, US
• Rengarajan Shanmugam · Chandler, US
• Thomas L. Sounart · Chandler, US
• Marcel Wall · Phoenix, US

Key dates

• Filing date: Sep 22, 2021
• Grant date: Jul 1, 2025
• Expiry date: Oct 30, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09672
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques directed to embedding capacitors in through glass vias within a glass core of a substrate. In embodiments, the through glass vias may extend entirely from a first side of the glass core to a second side of the glass core opposite the first side. Layers of electrically conductive material and dielectric material may then be deposited within the through glass via to form a capacitor. the capacitor may then be electrically coupled with electrical routings on buildup layers on either side of the glass core. Other embodiments may be described and/or claimed.