Process chamber process kit with protective coating
US12354843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2019 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Apr 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32477
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein generally relate to a method and apparatus for fabricating a chamber component for a plasma process chamber. In one embodiment a chamber component used within a plasma processing chamber is provided that includes a metallic base material comprising a roughened non-planar first surface, wherein the roughened non-planar surface has an Ra surface roughness of between 4 micro-inches and 80 micro-inches, a planar silica coating formed over the roughened non-planar surface, wherein the planar silica coating has a surface that has an Ra surface roughness that is less than the Ra surface roughness of the roughened non-planar surface, a thickness between about 0.2 microns and about 10 microns, less than 1% porosity by volume, and contains less than 2E12 atoms/centimeters2 of aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.