Method for OES data collection and endpoint detection
US12362158B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Apr 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of the plasma processing chamber for a first time duration; and after the first time duration, determining a process endpoint by: while exposing the substrate to the plasma by applying the first power to the first electrode, applying a second power to a second electrode of the plasma processing chamber for a second time duration that is shorter than the first time duration; and obtaining an optical emission spectrum (OES) from the plasma while applying the second power to the second electrode, where an energy of the second power over the second time duration is less than an energy of the first power over a sum of the first and the second time durations by a factor of at least 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.