Patent · US Active

Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods

US12368111B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Walter Hartner · Munich, DE
Christian Geissler · Teugn, DE
Thomas Kilger · Regenstauf, DE
Johannes Lodermeyer · Kinding, DE
Franz-Xaver Muehlbauer · Rimbach, DE
Martin Richard Niessner · Munich, DE
Claus Waechter · Sinzing, DE

Key dates

Filing date	Dec 20, 2018
Grant date	Jul 22, 2025
Priority date	—
Expiry date	Jan 17, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10977
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor apparatus comprises: a circuit board; a semiconductor package having a main surface, wherein the semiconductor package is arranged on the circuit board and the main surface faces the circuit board; a radio-frequency line element of the semiconductor package, which radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is designed to transmit a signal at a frequency of greater than 10 GHz; and an underfiller material arranged between the circuit board and the semiconductor package, wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.