3D multiple location compressing bonded arm for advanced integration

US12381118B2 · kind B2 · utility

Assignee

• TOKYO ELECTRON LIMITED · JP

Inventors

• Andrew WELOTH · Albany, US
• Daniel Fulford · Cohoes, US
• Anthony R. Schepis · Averill Park, US
• Mark I. Gardner · Mabank, US
• H. Jim Fulford · Austin, US
• Anton J. deVilliers · Boise, US
• David Conklin · Saratoga Springs, US

Key dates

• Filing date: Dec 14, 2022
• Grant date: Aug 5, 2025
• Expiry date: Jan 10, 2044

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L24/80
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Aspects of the present disclosure provide a bonding device for bonding two wafers. For example, the bonding device can include a first bonding chuck and a second bonding chuck. The first bonding chuck can have a first bonding head for a first wafer to be mounted thereon. The second bonding chuck can have a plurality of second bonding heads for a second wafer to be mounted thereon. The second bonding heads can be controlled individually to apply local pressures onto the second wafer to move the second wafer toward the first wafer to bond the second wafer to the first wafer, the local pressures corresponding to bow measurement of the first wafer and the second wafer.