Semiconductor device and semiconductor package including the same
US12381151B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first semiconductor chip that includes a first conductive pad whose top surface is exposed; and a second semiconductor chip that includes a second conductive pad whose top surface is exposed and in contact with at least a portion of the top surface of the first conductive pad. The first semiconductor chip may include a first diffusion barrier in contact with a bottom surface of the first conductive pad, and a second diffusion barrier in contact with a lateral surface of the first conductive pad, and the first diffusion barrier and the second diffusion barrier may include different materials from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.