Dongjoon Oh
12Patents
1h-index
13Co-inventors
43Inventor score
Filing activity: Oct 3, 2019 → May 20, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11798872B2 | Interconnection structure and semiconductor package including the same | Electricity | 1 | Active |
| US11139251B2 | Semiconductor package | Electricity | 1 | Active |
| US11996358B2 | Semiconductor packages having first and second redistribution patterns | Electricity | 1 | Active |
| US12224256B2 | Wafer structure and semiconductor device | Electricity | 0 | Active |
| US12381151B2 | Semiconductor device and semiconductor package including the same | Electricity | 0 | Active |
| US11664312B2 | Semiconductor device and semiconductor package including the same | Electricity | 0 | Active |
| US12009288B2 | Interconnection structure and semiconductor package including the same | Electricity | 0 | Active |
| US11854893B2 | Method of manufacturing semiconductor package | Electricity | 0 | Active |
| US12368093B2 | Semiconductor packages | Electricity | 0 | Active |
| US11923309B2 | Semiconductor package including fine redistribution patterns | Electricity | 0 | Active |
| US11652066B2 | Semiconductor package | Electricity | 0 | Active |
| US12347760B2 | Interconnection structure and semiconductor package including the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.