Systems and methods for thermal processing and temperature measurement of a workpiece at low temperatures

US12399064B2 · kind B2 · utility

Assignees

• Beijing E-Town Semiconductor Technology Co., Ltd. · CN
• Mattson Technology, Inc. · US

Inventors

• Rolf Bremensdorfer · Bibertal, DE
• Markus Lieberer · Augsburg, DE
• Paul Janis Timans · Mountain View, US
• Michael X. Yang · Palo Alto, US

Key dates

• Filing date: Jul 11, 2019
• Grant date: Aug 26, 2025
• Expiry date: Apr 25, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01J5/0007
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Systems and methods for thermal processing of a workpiece at low temperatures are disclosed. In one example implementation, a thermal processing apparatus includes a processing chamber having a workpiece support. The workpiece support can be configured to support a workpiece. The apparatus can include one or more heat sources configured to emit electromagnetic radiation in a first wavelength range to heat the workpiece to a processing temperature. The processing temperature can be in the range of about 50° C. to 150° C. The apparatus can include one or more sensors configured to obtain a measurement of electromagnetic radiation in a second wavelength range when the workpiece is at the processing temperature. The second wavelength range can be different from the first wavelength range.