Spatial optical emission spectroscopy for etch uniformity
US12405164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2023 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Nov 29, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8416
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.