Apparatus and method for bonding substrates
US12412865B2 · kind B2 · utility
0Cited by
18References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2022 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Feb 16, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.