Apparatus for treating substrate
US12428730B2 · kind B2 · utility
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18Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 10, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jun 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a chamber having an inner space, a support unit configured to support the substrate in the inner space, a gas supply tube configured to supply a gas onto the substrate supported on the support unit, a gas exhaust tube configured to exhaust the gas from the inner space, and a gas block connected to the gas supply tube and the gas exhaust tube and provided above the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.