Flow guide structures and heat shield structures, and related methods, for deposition uniformity and process adjustability

US12428731B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Zuoming ZHU · Sunnyvale, US
• Ala Moradian · Sunnyvale, US
• Shu-Kwan LAU · Sunnyvale, US
• John Tolle · Gilbert, US
• Manjunath Subbanna · Kanchinakote, IN
• Martin Jeffrey Salinas · Campbell, US
• Chia Cheng Chin · Fremont, US
• Thomas Kirschenheiter · Tempe, US
• Saurabh Chopra · Sunnyvale, US

Key dates

• Filing date: Dec 20, 2022
• Grant date: Sep 30, 2025
• Expiry date: Mar 14, 2044

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C30B25/14
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present disclosure relates to flow guide structures and heat shield structures, and related methods, for deposition uniformity and process adjustability. In one implementation, an apparatus for substrate processing includes a chamber body that includes a processing volume. The apparatus includes one or more heat sources. The apparatus includes a flow guide structure positioned in the processing volume. The flow guide structure includes one or more first flow dividers that divide the processing volume into a plurality of flow levels, and one or more second flow dividers oriented to intersect the one or more first flow dividers and divide each flow level of the plurality of flow levels into a plurality of flow sections. The flow guide structure includes one or more third flow dividers oriented to intersect the one or more second flow dividers and divide the plurality of flow sections into a plurality of flow zones.