Methods and materials for enhanced barrier performance and reduced via resistance
US12431358B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 16, 2020 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Sep 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53252
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the disclosure relate to methods and materials for forming barrier layers with enhanced barrier performance and/or reduced via resistance. Some embodiments of the disclosure provide methods for passivating a metal surface by exposing the metal surface to a metal complex comprising an organic ligand with at least three carbon atoms and a double or triple bond that eta bonds with a central metal atom. Some embodiments provide barrier layers within vias which enable a reduction in resistance of at least 25% as a result of thinner barrier layers with equivalent barrier properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.