Method for wafer treating
US4906328A · kind A · utility
30Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1988 |
| Grant date | Mar 6, 1990 |
| Priority date | — |
| Expiry date | Dec 12, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A processing apparatus and method utilizing a single process chamber to remove organics and metallic contaminates, remove native oxides, oxidize by heat and a oxidizing source, depositing a layer over the oxide formed with the capability of providing an source of additional ultraviolet light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.