Method and apparatus for removing solder mounted electronic components
US4934582A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1989 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | Sep 20, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.