Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
US5002008A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 26, 1989 |
| Grant date | Mar 26, 1991 |
| Priority date | — |
| Expiry date | May 26, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.