Method and apparatus for using desoldering material
US5072874A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1991 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | Jan 31, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.