Method and apparatus for the excise and lead form of TAB devices
US5210936A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1992 |
| Grant date | May 18, 1993 |
| Priority date | — |
| Expiry date | Jan 6, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second portion spaced further from the chip than the first portion. An excise blade cuts the leads outside the second portion. Then the excise/form tool, second clamp and excise blade move downwards in a curved path toward the chip to form a first lead corner against the form anvil and a second lead corner against the excise/form tool without splaying or galling the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.