Multi-layer thin film structure and parallel processing method for fabricating same
US5258236A · kind A · utility
55Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1991 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | May 3, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.