Removable adhesives for attachment of semiconductor dies
US5336649A · kind A · utility
32Cited by
37References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1992 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Nov 13, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to provide pretested bare semiconductor integrated circuit die, a temporary mechanical connection is effected by the use of a soluble material. A semipermanent electrical connection is effected, in which the parameters of the connection are controlled, so that the die remains functional subsequent to burnin and test. Subsequent to testing and burnin, the die are removed from the package body. The technique is useful in providing known good die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.