Combined wafer support and temperature monitoring device
US5356486A · kind A · utility
31Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1991 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Mar 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A combined wafer support and thermocouple assembly comprising a wafer support basket having a plurality of wafer support fingers, one of which includes a low mass, low heat constant support for supporting a thermocouple against the backside of a wafer positioned on the basket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.