Method of drilling vias and through holes
US5363553A · kind A · utility
4Cited by
1References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1993 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Jul 27, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of producing vias and through holes through a metal laminate. The laminate is a multi-layer, for example, a trilayer of a relatively hard metal between two layers of a relatively soft metal. The method includes the steps of first etching a clearance hole through the soft metal on one side of the trilayer laminate, followed by partially etching the hard metal layer. Next, drilling the remaining thickness of the hard metal, and drilling through the second layer of soft metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.