Guard ring electrostatic chuck
US5463525A · kind A · utility
71Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1993 |
| Grant date | Oct 31, 1995 |
| Priority date | — |
| Expiry date | Dec 20, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck suppresses the formation of vacuum arcs between the back of the wafer being processed and the body of the chuck by the interposition of a guard ring that floats close to the self-bias potential induced by the plasma on the wafer, thereby capacitively dividing the voltage between the wafer and the closest electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.