Minimal capture pads applied to ceramic vias in ceramic substrates
US5464682A · kind A · utility
9Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1993 |
| Grant date | Nov 7, 1995 |
| Priority date | — |
| Expiry date | Dec 14, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.