Module input-output pad having stepped set-back
US5483105A · kind A · utility
5Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1994 |
| Grant date | Jan 9, 1996 |
| Priority date | — |
| Expiry date | Apr 25, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic substrate pad used for establishing brazed connection between a pin and the substrate in the packaging of microelectronic semiconductor circuit chip. The pad is characterized by a stepped setback in the upper surface thereof which setback is oxidized to prevent wetting by the brazing alloy which bonds the pin to the pad. Stresses attributable to the brazing are isolated from the setback area and thus have reduced effect in causing cracking at the edges of the pad-substrate interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.