Method for fabricating multi-layer thin film structure having a separation layer
US5534094A · kind A · utility
51Cited by
24References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1994 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Sep 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.