Patent · US Expired

Method of making electrostatic chuck with oxide insulator

US5535507A · kind A · utility

33Cited by
5References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 20, 1993
Grant dateJul 16, 1996
Priority date
Expiry dateDec 20, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49117
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An electrostatic chuck is made by a method in which the component parts are machined, then anodized to provide a hard insulating surface, and then assembled in a fixture, to provide a planar surface for wafer support that retains superior insulating properties; gas may be fed from the rim only, diffusing within interstices between the clamping surface and the wafer and maintaining a desired pressure by flowing radially through an impedance determined by the average spacing between clamping surface and wafer, thereby providing uniform pressure across the clamping surface without the use of elastomeric seals.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.