Method for supporting a wafer in a combined wafer support and temperature monitoring device
US5567909A · kind A · utility
12Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Sep 20, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A combined wafer support and thermocouple assembly comprising a wafer support basket having a plurality of wafer support fingers, one of which includes a low mass, low heat constant support for supporting a thermocouple against the backside of a wafer positioned on the basket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.