Method for packaging semiconductor dice
US5593927A · kind A · utility
223Cited by
18References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1995 |
| Grant date | Jan 14, 1997 |
| Priority date | — |
| Expiry date | Dec 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for packaging a semiconductor die includes forming an additional protective layer and conductive traces on the die. The die is then placed in a multi-die holder having electrical connectors for establishing an electrical connection to the conductive traces. The protective layer is formed as a thin or thick film of an electrically insulating material such as a polymer, glass, nitride or oxide. In addition, the protective layer can be formed with a tapered peripheral edge to facilitate insertion of the die into the die holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.