John O. Jacobson
61Patents
21h-index
18Co-inventors
81Inventor score
Filing activity: Dec 1, 1995 → Oct 6, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5593927A | Method for packaging semiconductor dice | Electricity | 223 | Expired |
| US5931685A | Interconnect for making temporary electrical connections with bumped semiconductor components | Electricity | 121 | Expired |
| US5915977A | System and interconnect for making temporary electrical connections with bumped semiconductor components | Electricity | 118 | Expired |
| US5893726A | Semiconductor package with pre-fabricated cover and method of fabrication | Electricity | 110 | Expired |
| US6462423B1 | Flip-chip with matched lines and ground plane | Electricity | 101 | Expired |
| US5952840A | Apparatus for testing semiconductor wafers | Physics | 86 | Expired |
| US5894218A | Method and apparatus for automatically positioning electronic dice within component packages | Emerging Cross-Sectional Technologies | 85 | Expired |
| US6247629A | Wire bond monitoring system for layered packages | Electricity | 83 | Expired |
| US6208157A | Method for testing semiconductor components | Physics | 79 | Expired |
| US6072326A | System for testing semiconductor components | Physics | 78 | Expired |
| US6057597A | Semiconductor package with pre-fabricated cover | Electricity | 61 | Expired |
| US5907492A | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 60 | Expired |
| US6363295B1 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 42 | Expired |
| US6239590A | Calibration target for calibrating semiconductor wafer test systems | Emerging Cross-Sectional Technologies | 40 | Expired |
| US6064216A | Apparatus for testing semiconductor wafers | Physics | 37 | Expired |
| US6553276B2 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 37 | Expired |
| US6420892B1 | Calibration target for calibrating semiconductor wafer test systems | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6362637B1 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Physics | 34 | Expired |
| US6064194A | Method and apparatus for automatically positioning electronic dice within component packages | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6396291B1 | Method for testing semiconductor components | Physics | 27 | Expired |
| US5955877A | Method and apparatus for automatically positioning electronic dice within component packages | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5786632A | Semiconductor package | Electricity | 20 | Expired |
| US6900459B2 | Apparatus for automatically positioning electronic dice within component packages | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7155300B2 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 16 | Expired |
| US7120513B1 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Electricity | 16 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.