Fluorinated fluxless soldering
US5615825A · kind A · utility
10Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 1995 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | May 12, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder surface to reduce or eliminate or chemically convert the surface oxides. The process can take place at atmospheric pressure and room temperature. A simple belt driven transport may be used to move the parts past a nozzle which emits the vapor in a system similar to a conventional solder reflow machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.