Method of manufacturing sensor

US5616523A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Gerhard Benz · Eppelheim, DE
• Jiri Marek · Reutlingen, DE
• Frank Bantien · Ditzingen, DE
• Horst Muenzel · Reutlingen, DE
• Franz Laermer · Stuttgart, DE
• Michael Offenberg · Lörrach, DE
• Andrea Schilp · Schwäbisch Gmünd, DE

Key dates

• Filing date: Apr 2, 1996
• Grant date: Apr 1, 1997
• Expiry date: Apr 2, 2016

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0828
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for manufacturing sensors from a multilayer plate with upper and lower monocrystalline silicon layers and an etching layer between them. The upper silicon layer is structured by the introduction of troughs therein extending down to the etching layer. Sensor structures, such as a bending beam that is used in an acceleration sensor, are created by etching the etching layer beneath a part of the silicon layer structured in this manner.