Method for electrically conductive metal-to-metal bonding
US5617991A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1995 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | Dec 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a method for electrically conductive metal-to-metal bonding. The method for bonding flat metal surfaces comprises the steps of depositing a thin layer of titanium on a first surface of a first metal surface, placing the first surface of the first metal surface in contact with a first surface of a second metal surface in an inert ambiance, heating the inert ambiance to a temperature substantially below the melting point of the metal surfaces, and forming a titanium metal bond between the first metal surface and the second metal surface to provide a low resistive path between the first metal surface and the second metal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.