Method for making printed circuit board with flush surface lands
US5659951A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1996 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Apr 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making a printed circuit board with a flush surface land begins by forming a multi-layer printed circuit board with a recess in a surface dielectric layer. Then, a hole is drilled into or through the printed circuit board; the hole communicates with the recess. After the recess is formed, a conductive material is provided in the recess to form a surface land and provided on an inner surface of the hole to form a plated hole which is electrically connected to the surface land. The conductive material in the recess has a thickness substantially equal to a depth of the recess such that the surface land is flush with an adjacent surface of the dielectric surface layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.