Method of bonding an aluminum wire to an intergrated circuit bond pad
US5661081A · kind A · utility
15Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1994 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Sep 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing bonding pad adapted for use with an aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon layer, a refractory metal layer, and a thick aluminum alloy bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.