Polishing aparatus and method
US5679059A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 28, 1995 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Nov 28, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67219
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.