Polishing apparatus
US5679063A · kind A · utility
41Cited by
4References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 24, 1996 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Jan 24, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.