Method for production of silicon wafer and apparatus therefor
US5679212A · kind A · utility
40Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1995 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Sep 28, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/228
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The work of grinding of a silicon wafer is carried out in an etchant containing no loose abrasive and permitting selective etching of deformed layers existent in the surface part of said wafer. The removal of the deformed layers and the heavy metals from the wafer is effected simultaneously and quickly owing to the execution of the work of grinding in the etchant and the consequent synergism of the work of grinding and etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.