Tadahiro Kato
35Patents
12h-index
37Co-inventors
81Inventor score
Filing activity: May 12, 1987 → Mar 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5942445A | Method of manufacturing semiconductor wafers | Electricity | 97 | Expired |
| US5800725A | Method of manufacturing semiconductor wafers | Electricity | 49 | Expired |
| US5679212A | Method for production of silicon wafer and apparatus therefor | Performing Operations; Transporting | 40 | Expired |
| US5951374A | Method of polishing semiconductor wafers | Performing Operations; Transporting | 33 | Expired |
| US5494862A | Method of making semiconductor wafers | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6726525B1 | Method and device for grinding double sides of thin disk work | Performing Operations; Transporting | 31 | Expired |
| US6491836B1 | Semiconductor wafer and production method therefor | Electricity | 25 | Expired |
| US8037878B2 | Method for slicing workpiece by using wire saw and wire saw | Performing Operations; Transporting | 18 | Active |
| US4759961A | Coating method with crosslinked coatings from two coat-one bake systems | Chemistry; Metallurgy | 17 | Expired |
| US6050880A | Surface grinding device and method of surface grinding a thin-plate workpiece | Performing Operations; Transporting | 15 | Expired |
| US6652358B1 | Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine | Performing Operations; Transporting | 15 | Expired |
| US5447890A | Method for production of wafer | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5474644A | Method and apparatus for high-flatness etching of wafer | Electricity | 12 | Expired |
| US7507146B2 | Method for producing semiconductor wafer and semiconductor wafer | Electricity | 11 | Expired |
| US6444317B1 | Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the same | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6284658A | Manufacturing process for semiconductor wafer | Electricity | 8 | Expired |
| US6077149A | Method and apparatus for surface-grinding of workpiece | Performing Operations; Transporting | 8 | Expired |
| US6660337B2 | Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6239039A | Semiconductor wafers processing method and semiconductor wafers produced by the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6883342B2 | Multiform gas heat pump type air conditioning system | Mechanical Engineering; Lighting; Heating | 5 | Expired |
| US6787797B2 | Semiconductor wafer and device for semiconductor device manufacturing process | Electricity | 5 | Expired |
| US6220928A | Surface grinding method and apparatus for thin plate work | Performing Operations; Transporting | 5 | Expired |
| US7332437B2 | Method for processing semiconductor wafer and semiconductor wafer | Electricity | 5 | Expired |
| US6346485B1 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6432837B1 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.