High-density electronic module
US5714802A · kind A · utility
64Cited by
13References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1994 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Mar 31, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly dense electronic module for installation into a computer or other electronic device comprises at least one wafer or wafer section and means for connection with the electronic device. With an embodiment comprising plural wafer sections, the wafer sections are mechanically joined and electrically coupled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.