Method and structure for improving gas breakdown resistance and reducing the potential of arcing in an electrostatic chuck
US5715132A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Mar 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The basic structure facilitates the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck addresses the problem of the RF plasma environment which seeks the interface between the electrostatic chuck dielectric surface layer and its underlying conductive layer, and includes an underlying conductive layer which contains at least one gas flow passageway and at least one dielectric layer overlying said conductive layer. The dielectric layer forms the upper surface of the chuck and contains at least one opening or passageway which connects with the fluid flow passageway in the conductive layer. The distance between the upper surface of the conductive layer and the upper surface of the chuck is greater in the area adjacent to the opening to a fluid flow passageway to the upper surface of the chuck. As a result, the dielectric layer thickness is greater in the area adjacent to the opening or passageway than at other locations on the surface of the chuck. The insulative dielectric structure as the upper surface of the chuck and improve the isolation of the dielectric surface from the underlying conductive layer. Typically, the conductive layer is an alum…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.