Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages
US5747095A · kind A · utility
15Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1997 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Feb 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.