Method of making electrostatic chuck with conformal insulator film

US5753132A · kind A · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shamouil Shamouilian · San Jose, US
• Sasson Somekh · Los Altos Hills, US
• Hyman J. Levinstein · Berkeley Heights, US
• Manoocher Birang · Los Gatos, US
• Semyon Sherstinsky · San Francisco, US
• John F. Cameron · Los Altos, US

Key dates

• Filing date: Oct 4, 1996
• Grant date: May 19, 1998
• Expiry date: Oct 4, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H02N13/00
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process for fabricating an electrostatic chuck (20) comprising the steps of (c) forming a base (80) having an upper surface with cooling grooves (85) therein, the grooves sized and distributed for holding a coolant therein for cooling the base; and (d) pressure conforming an electrical insulator layer (45) to the grooves on the base by the steps of (i) placing the base into a pressure forming apparatus (25) and applying an electrical insulator layer over the grooves in the base; and (ii) applying a sufficiently high pressure onto the insulator layer to pressure conform the insulator layer to the grooves to form a substantially continuous layer of electrical insulator conformal to the grooves on the base.