Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure
US5757079A · kind A · utility
53Cited by
10References
8Claims
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Key dates
| Filing date | Dec 21, 1995 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Dec 21, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.