Method and apparatus for pressure control in vacuum processors
US5758680A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Mar 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/7761
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method and apparatus is disclosed for controlling the pressure of reaction chamber in wafer processing equipment. The disclosed apparatus and method uses a ballast port for inserting gas into the evacuation system, thereby controlling the pressure in the reaction chamber. The disclosed apparatus and method further uses estimation curves to estimate the desired position of a controlled gate valve which is located between the reaction chamber and turbo pump. The disclosed apparatus and method further introduces process gases at higher rate than set point levels to reduce the transition time or stabilization time required when raising the pressure in the reaction chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.